Prezentace
Presentation Labara Presentation Rochling
Solder Mask - Solder Pallet
Durostone® PCB Solder Pallet Materials
Durostone® PCB Solder Pallet Materials:
Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in wave soldering processes, Durostone® CHP760, CAS761 & CAG762.
These materials offer the following features:
- Excellent mechanical properties at elevated temperatures including the lead-free process
- Low thermal conductivity
- Excellent machining properties enabling the manufacture of complex design solder pallets
- Good resistance to chemicals used in modern fluxes
Durosto
ne® Harsh environments:
A combination of flux, temperature and process cycles can result in the degradation of the standard Durostone® grades of material.
The solution is Durostone® CFR767: excelent for use with aggressive fluxes and high process temperatures.
The resin used to produce Durostone® CFR767 can withstand temperatures up to 300 °C. The decision to use Durostone® CFR767 over one of the standard grades is made when the solder bath temperature exceeds 265 °C and the bottom side PCB pre-heat exceeds 140 °C.
Durostone® CFR767 has excellent flux resistance. When fluxes containing halides or dicarboxylic acids are used in high volume production the lifespan of the standard grades of material can be reduced so Durostone® CFR767 is an ideal solution.
Machining and assembly of solder pallets:
Example of using a simple
soldering mask on a PCB
LABARA s.r.o. customized machining and assembly of solder pallets. Production according to drawing documentation and complete technical solution.
Technical data:
|
|
DUROSTONE CHP 760 |
DUROSTONE CAS 761 |
DUROSTONE CAG 762 |
DUROSTONE CFR767 |
|
class |
standard |
antistatic |
antistatic (optic) |
Flux Resistant |
|
colour |
blue |
black |
grey |
dark red |
|
density (g/cm3) |
1,90 |
1,90 |
1,90 |
1,80 |
|
flexural strength (Mpa) |
360 |
360 |
360 |
380 |
|
water absorbtion (%) |
< 0,20 |
< 0,20 |
< 0,20 |
< 0,20 |
|
coefficient of linear expansion (10-6/K) between 30° and 200°C |
13 |
11 |
11 |
11 |
|
thermal conductivity (W/m0K) |
0,25 |
0,25 |
0,25 |
0,23 |
|
Maximum Operating Temperature (°C), |
300 |
300 |
300 |
380 |
|
Continuous Operating Temperature (°C) |
260 |
260 |
260 |
300 |
|
Surface Resistivity (Ω) |
- |
105 - 109 |
105 - 109 |
105 - 109 |
|
modul of elasticity (Mpa) @ 23 °C |
18,000 |
18,000 |
18,000 |
18,000 |
|
Sheet Size (mm) |
2440x1220 |
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|
Thickness' available (mm) |
3 mm, 4 mm, 5 mm, 6 mm, 8 mm, 10 mm, 12 mm |
5 mm, 6 mm, 8 mm, 10 mm |
||
|
Thickness Tolerance |
± 0,20 mm |
|||
|
Flatness Tolerance * (for a panel size of 300 x 300 mm) |
± 0,20 mm |
|||
|
Parallelism |
± 0,10 mm |
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